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They don't like to use tin inside semiconductors.<br>
<br>
At the board level tin can cause problems because solder contains a lot of
tin. <br>
Also, many connectors have tin plated contacts. Heat, electrical charge,
pressure from spring loaded <br>
contacts, and time, exacerbate the situation. <br>
<br>
Silver will act similarly. Also, mating tin plated connectors with gold
plated contacts can react with atmospheric moisture <br>
and gases to cause a buildup of insulating materials that make a connector
contact "go open" after a while. This is why you<br>
should not mate tin plated memory boards into sockets with gold plated contacts.
You need to mate gold to gold, <br>
and tin to tin. In fact, mating dissimilar metals in an environment where
heat, contact pressure, electrical charge are <br>
factors is a bad idea, period.<br>
<br>
In general tin has a lot of nasty attributes.<br>
<br>
Glen<br>
<br>
<br>
Andrew Piskorski wrote:<br>
<blockquote type="cite" cite="mid20040926002624.GA36445@piskorski.com">
<pre wrap="">On Fri, Sep 24, 2004 at 10:53:24AM -0600, Robin Laing wrote:
</pre>
<blockquote type="cite">
<pre wrap="">Tin Whisker (and Other Metal Whisker) Homepage
<a class="moz-txt-link-freetext" href="http://nepp.nasa.gov/whisker/index.html">http://nepp.nasa.gov/whisker/index.html</a>
</pre>
</blockquote>
<pre wrap=""><!---->
Interesting, I had not heard about that. Any idea how the
semiconductor industry handles that, and how long have they been doing
so? I assume they do, as there's computer equipment ALL OVER modern
fabs...
</pre>
</blockquote>
<br>
<pre class="moz-signature" cols="$mailwrapcol">--
Glen E. Gardner, Jr.
AA8C
AMSAT MEMBER 10593
<a class="moz-txt-link-abbreviated" href="mailto:Glen.Gardner@verizon.net">Glen.Gardner@verizon.net</a>
<a class="moz-txt-link-freetext" href="http://members.bellatlantic.net/~vze24qhw/index.html">http://members.bellatlantic.net/~vze24qhw/index.html</a>
</pre>
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