[Beowulf] Teraflop chip hints at the future
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Mark Hahn hahn at mcmaster.caMon Feb 12 21:46:49 PST 2007
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> Intel is stacking dram dice above the cpu as an L4 cache, but the article stacking seems like a major hack - I'd rather think about how to do processor-in-memory (perhaps zram?). also, current production dram is around 1Gb/128MB, and the chip's already got 400 KB of memory onchip. it's still really important to have a substantial fan-out from cpu to memory for capacity. > doesn't really > explain how they plan to expand the off-chip bw other than by going to > photonics > eventually. isn't photonics still at the hand-waving stage? I was just noticing how 10G XFP's have not gotten much cheaper over the past couple years. is there really a prospect for wide and fast photonic links, given that copper links are at ~3 Gb pretty easily? have people figured out how to mass-produce photonic-chipped systems as efficient as copper PC boards and bumped chips?
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